MEMS
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Analog Top & Bottom Port Microphones
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Digital Top & Bottom Port Microphones
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High SNR
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Small Package
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Max RF protection
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Omnidirectional
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Wide-band Frequency Response
因为BSE MEMS Microphone使用silicon wafer process,所以在多种环境中的performance得到了进一步提高。而且,相对于ECM(Electret Condenser Microphones),其规格越趋小型化。

本MEMS microphones被广泛应用于cell phones、smart phones、smart TV、PDAs、digital still cameras、IC recorders、laptop PCs、notebook、robot cleaners、refrigerators、tablet PCs等Customer电器音响产品,MEMS Microphone以最典型的ECM(Electret Conderser Microphones)工作原理作为基础。

本MEMS Microphone以T&R(Tape and Real)方式的包装形式予以提供,基本上可适用自动化的SMT Process。
View Output Size
[mm]
Sound
Port
Sensitivity
(dB relV/1Pa)
SNR
[dB(A)]
AOP
[dBSPL]
Data
Sheet
Analog 4.00x3.00x1.20 Bottom -38±1 70 136 Link
-38±1 69 133
Analog 3.50x2.65x0.98 Bottom -38±1 66.5 124 Link
Analog 2.75x1.85x0.90 Bottom -38±1 62.5 124 Link
Digital 4.00x3.00x1.20 Bottom -36±1 68.5 130.5 Link
-36±1 65.5 130
Digital 4.00x3.00x1.00 Bottom -26±1 64.6 120 Link
-26±1 64 119
Digital 3.50x2.65x0.98 Bottom -26±1 64.5 121 Link
-26±1 63.5 121