MEMS
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Analog Top & Bottom Port Microphones
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Digital Top & Bottom Port Microphones
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High SNR
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Small Package
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Max RF protection
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Omnidirectional
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Wide-band Frequency Response
因为BSE MEMS Microphone使用silicon wafer process,所以在多种环境中的performance得到了进一步提高。而且,相对于ECM(Electret Condenser Microphones),其规格越趋小型化。
本MEMS microphones被广泛应用于cell phones、smart phones、smart TV、PDAs、digital still cameras、IC recorders、laptop PCs、notebook、robot cleaners、refrigerators、tablet PCs等Customer电器音响产品,MEMS Microphone以最典型的ECM(Electret Conderser Microphones)工作原理作为基础。
本MEMS Microphone以T&R(Tape and Real)方式的包装形式予以提供,基本上可适用自动化的SMT Process。
本MEMS microphones被广泛应用于cell phones、smart phones、smart TV、PDAs、digital still cameras、IC recorders、laptop PCs、notebook、robot cleaners、refrigerators、tablet PCs等Customer电器音响产品,MEMS Microphone以最典型的ECM(Electret Conderser Microphones)工作原理作为基础。
本MEMS Microphone以T&R(Tape and Real)方式的包装形式予以提供,基本上可适用自动化的SMT Process。
View | Output | Size [mm] |
Sound Port |
Sensitivity (dB relV/1Pa) |
SNR [dB(A)] |
AOP [dBSPL] |
Data Sheet |
---|---|---|---|---|---|---|---|
Analog | 4.00x3.00x1.20 | Bottom | -38±1 | 70 | 136 | Link | |
-38±1 | 69 | 133 | |||||
Analog | 3.50x2.65x0.98 | Bottom | -38±1 | 66.5 | 124 | Link | |
Analog | 2.75x1.85x0.90 | Bottom | -38±1 | 62.5 | 124 | Link | |
Digital | 4.00x3.00x1.20 | Bottom | -36±1 | 68.5 | 130.5 | Link | |
-36±1 | 65.5 | 130 | |||||
Digital | 4.00x3.00x1.00 | Bottom | -26±1 | 64.6 | 120 | Link | |
-26±1 | 64 | 119 | |||||
Digital | 3.50x2.65x0.98 | Bottom | -26±1 | 64.5 | 121 | Link | |
-26±1 | 63.5 | 121 |